半導体装置及びその製造方法、回路基板並びに電子機器

Semiconductor device and its manufacturing method, circuit board, and electronic apparatus

Abstract

PROBLEM TO BE SOLVED: To connect electrodes and a wiring pattern electrically with hight positional accuracy and to provide a highly reliable semiconductor device and a method of manufacture. SOLUTION: The method for manufacturing a semiconductor device where a semiconductor chip 10 and a substrate 20 are heated in order to connect a plurality of electrodes 12 formed on the semiconductor chip 10 with a wiring pattern 22 formed on the substrate 20 comprises a step for heating the semiconductor chip 10 and the substrate 20 such that expansion of the semiconductor chip 10 will be substantially equal to expansion of the substrate 20, and a step for connecting the electrodes 12 electrically with the wiring pattern 22 while facing the side of the semiconductor chip 10 where the electrodes 12 are formed with the side of the substrate 20 where the wiring pattern 22 is formed. COPYRIGHT: (C)2001,JPO
(57)【要約】 【課題】 本発明の目的は、電極と配線パターンとを位 置精度よく電気的に接続し、かつ、信頼性の高い半導体 装置及びその製造方法を提供することにある。 【解決手段】 半導体装置の製造方法は、半導体チップ 10に形成されてなる複数の電極12と、基板20に形 成されてなる配線パターン22とを電気的に接続するた めに前記半導体チップ10と前記基板20とを加熱する 半導体装置の製造方法であって、前記加熱による、前記 半導体チップ10の膨張量と前記基板20の膨張量とが ほぼ等しくなるように、前記半導体チップ10及び前記 基板20を加熱する工程と、前記半導体チップ10の前 記電極12の形成された側の面を前記基板20の配線パ ターン22が形成された面に対向させて、前記電極12 と前記配線パターン22とを電気的に接続する工程と、 を含む。

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)

    Title

Cited By (9)

    Publication numberPublication dateAssigneeTitle
    CN-102272907-BMay 14, 2014豪锐恩科技私人有限公司In-situ melt and reflow process for forming flip-chip interconnections and system thereof
    EP-2244541-A1October 27, 2010SIIX CorporationSurface mount circuit board, method for manufacturing a surface mount circuit board, and method for mounting surface mount electronc devices
    JP-2012114239-AJune 14, 2012Panasonic Corp, パナソニック株式会社Apparatus and method for mounting component
    US-7118939-B2October 10, 2006Seiko Epson CorporationManufacturing method and manufacturing apparatus for semiconductor device
    US-7157308-B2January 02, 2007Seiko Epson CorporationCircuit substrates, semiconductor devices, semiconductor manufacturing apparatus methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices
    US-7595228-B2September 29, 2009Fujitsu LimitedMethod for manufacturing electronic component-mounted board
    US-8136238-B2March 20, 2012Seiko Epson CorporationMethods for manufacturing semiconductor devices
    WO-2004086493-A1October 07, 2004Fujitsu LimitedMethod for manufacturing electronic component-mounted board
    WO-2010053454-A1May 14, 2010Orion Systems Integration Pte LtdProcédé de fusion et de refusion in-situ permettant de former des interconnexions par bossages et système associé